Semiconductor Wafer Ultrasonic Cleaning Machine

Core Features: Ultrasonic frequency 80kHz-170kHz for high-frequency precision cleaning, power 300W-1500W with precise power control, tank made of high-purity stainless steel 316L with PFA coating; supports liquid immersion megasonic-assisted cleaning, temperature control accuracy ±0.5°C, time control accuracy ±1 second, compatible with Class 100 (ISO 14644) cleanroom environment, compliant with RoHS/REACH certification, specifically designed for high-precision electronic components such as semiconductor wafers and chips.

Product Advantages: The semiconductor wafer ultrasonic cleaner achieves micron-level particle removal, 170kHz high frequency avoids damaging the wafer surface, PFA coating prevents secondary contamination; megasonic-assisted technology ensures ≥99% removal rate of submicron contaminants, compatible with the entire semiconductor manufacturing process, and is a key cleaning device for improving wafer yield and ensuring chip performance.