Core Functions: Ultrasonic frequencies adjustable at 40kHz, 80kHz, and 120kHz; power ranging from 800W to 3000W with zoned control; tank capacity customizable from 50L to 300L; integrates ultrasonic cleaning with spray rinsing combination mode; removal rate of 0.1μm particles ≥99%; tank made of stainless steel 316L with Teflon coating; features touch screen and PLC programmable control, specifically designed for photovoltaic wafers, semiconductor wafers, and quartz wafers.
Product Advantages: The wafer ultrasonic cleaning machine adapts to different technological stages of wafers through three-frequency switching, with low frequencies removing oxide layers and high frequencies ensuring scratch-free surfaces; spray rinsing prevents cleaning agent residues, and Teflon coating enhances tank corrosion resistance. Suitable for cleaning 4-8 inch wafers, it is specialized equipment for photovoltaic power plants and semiconductor factories to improve wafer cleanliness and photoelectric conversion efficiency.
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